摘要：

在半导体加工生产过程中会产生大量强络合性的含铜除胶废水。分别对比了硫化钠沉淀法、次氯酸钠氧化法、亚铁沉淀法及硫酸亚铁-过硫酸钾氧化法4种不同工艺的处理效果，硫化钠沉淀法以去除铜效果好、处理成本低的显著优势，优选为最佳处理方法。考察了n（Na₂S）∶n（Cu）、反应pH及反应时间等对去除络合铜的影响，并通过响应曲面法对工艺条件进行优化。结果表明，对络合铜去除效率的贡献排序为n（Na₂S）∶n（Cu）>反应pH>反应时间，并且在n（Na₂S）∶n（Cu）为14∶1，反应pH为10.5，反应时间为60 min的最优工艺参数条件下，出水铜小于0.146 mg/L，铜的去除率达到98.8%。

关键词: 络合铜除胶废水, 硫化钠沉淀法, 次氯酸钠氧化法, 亚铁沉淀法, 响应曲面法

Abstract:

During the processing and production of semiconductors, a large amount of copper-containing desmear wastewater with strong chelating properties is generated. The effects of four different treatment processes, namely the Na₂S precipitation method, the sodium hypochlorite oxidation method, the ferrous precipitation method, and the ferrous-potassium persulfate oxidation method, were compared. The Na₂S precipitation method was selected as the best treatment method due to its significant advantages of good copper removal effect and low treatment cost. The effects of the n(Na₂S)∶n(Cu) molar ratio, reaction pH, and reaction time on the removal of chelated copper were investigated, and the process conditions were optimized by the response surface method. The results showed that the order of contribution to the removal efficiency of chelated copper was n(Na₂S)∶n(Cu)>reaction pH>reaction time. Under the optimal process parameters of n(Na₂S)∶n(Cu) of 14:1, reaction pH of 10.5,and reaction time of 60 min, the copper content in the effluent was less than 0.146 mg/L, and the copper removal rate reached 98.8%.

Key words: chelated copper desmear wastewater, Na₂S precipitation method, sodium hypochlorite oxidation method, ferrous precipitation method, response surface methodology

中图分类号: 

• X703.1